Germanium condensation is demonstrated using a two-step wet oxidation of germanium implanted Silicon-On-Insulator (SOI). Samples of 220nm thick SOI are implanted with a nominal fluence of 5x1016cm-2 Ge+ at an energy of 33keV. Primary post-implantation wet oxidation is performed initially at 870°C for 70 minutes, with the aim of capping the sample without causing significant dose loss via Ge evaporation through the sample surface. This is followed by a secondary higher temperature wet oxidation at either 900°C, 1000°C or 1080°C. The germanium retained dose and concentration profile, and the oxide thickness is examined after primary oxidation, and various secondary oxidation times, using Rutherford backscattering analysis. A mixed SiGe oxide is observed to form during the primary oxidation followed by a pure silicon oxide after higher temperature secondary oxidation. The peak germanium concentration, which varies with secondary oxidation condition, is found to range from 43 at- % to 95 at- %, while the FWHM of the Ge profile varies from 13 to 5nm, respectively. It is also observed that both the diffusion of germanium and the rate of oxidation are enhanced at 870°C and 900°C compared to equilibrium expectations. Transmission electron microscopy of a representative sample with secondary oxidation at 1080oC for 20 minutes shows that the SiGe layer is crystalline in nature and seeded from the underlying silicon. Raman spectroscopy is used to determine residual strain in the SiGe region following secondary oxidation. The strain is compressive in nature and increases with Ge concentration to a maximum of approximately 1% in the samples probed. In order to elucidate the physical mechanisms, which govern the implantation-condensation process, we fit the experimental profiles of the samples with a model that uses a modified segregation boundary condition; a modified linear rate constant for the oxidation; and an enhanced diffusion coefficient of germanium where the enhancement is inversely proportional to the temperature and decays with increasing time. Comparison of the modelled and experimental results shows reasonable agreement and allows conclusions to be made regarding the dominant physical mechanisms, despite the semi-empirical nature of the model used.
展开▼
机译:使用两步湿法注入锗的绝缘体上硅(SOI)可以证明锗缩合。以33keV的能量注入5x1016cm-2 Ge +的标称通量注入220nm厚的SOI样品。初始植入后的湿式氧化最初在870°C进行70分钟,目的是将样品封盖,而不会因穿过样品表面的Ge蒸发而造成明显的剂量损失。随后是在900°C,1000°C或1080°C的二次高温湿法氧化。使用Rutherford背散射分析,在一次氧化和各种二次氧化时间后,检查了锗的保留剂量和浓度分布以及氧化物厚度。观察到在初次氧化过程中形成混合的SiGe氧化物,然后在高温二次氧化后形成纯氧化硅。发现锗的峰值浓度随二次氧化条件而变化,范围为43 at-95 at%,而Ge轮廓的FWHM分别为13-5 nm。还观察到,与平衡预期相比,锗的扩散和氧化速率在870°C和900°C时均得到增强。代表性样品的透射电子显微镜在1080oC进行了20分钟的二次氧化,显示出SiGe层本质上是晶体,并从下面的硅中注入。拉曼光谱法用于确定二次氧化后SiGe区域中的残余应变。该应变本质上是压缩性的,并且随着Ge浓度的增加而增加,在所探查的样品中最大达到大约1%。为了阐明控制注入-凝聚过程的物理机制,我们将样品的实验曲线与使用改良的偏析边界条件的模型进行拟合;用于氧化的修饰的线性速率常数;锗的扩散系数增强,其中增强与温度成反比,并随时间增加而衰减。尽管所用模型具有半经验性,但对模型结果和实验结果的比较显示出合理的一致性,并且可以得出关于主要物理机制的结论。
展开▼